Organizers

General Co-Chairs

Roman Obermaisser	University of Siegen, Germany
Roberto Passerone	University of Trento, Italy

 

Program Committee Chair

Marco Di Natale	Scuola Superiore S. Anna, Pisa, Italy
Achim Rettberg	Carl von Ossietzky University Oldenburg, Germany

 

Finance Chairs

Marcin Grzegorzek	University of Siegen, Germany
Richard Zurawski	ISA Group., USA

 

Publication Chair

René Krenz-Baath

Hamm-Lippstadt University of Applied Sciences

 

SIES Series Steering Committee

R. Ernst, TUB, Germany
G. De Micheli, EPFL, Switzerland
R. Gupta, UC San Diego, USA
A. S.-Vincentelli, UC Berkeley, USA
R. Zurawski, ISA Group, USA

International Advisory Committee

E. Dekneuvel, UNSA, France
L. Gomes, Uninova, Portugal
T. Nolte, Mälardalen University, Sweden
R. Passerone, Univ. of Trento, Italy
G. Sassatelli, LIRM, France
E. Tovar, IPP, Portugal
A. Vachoux, EPFL, Switzerland
J. J. Chen, KIT, Germany
M. Di Natale, Scuola Superiore S. Anna, Italy

 

Program Committee

L. Cucu-Grosjean, INRIA Paris-Rocquencourt, France
H. Aydin, George Mason University, USA
L. Lavagno, Politecnico di Torino, Italy
L. Santinelli, ONERA, France
N. Bombieri, University of Verona, Italy
G. Buttazzo, Scuola Superiore S. Anna, Italy
G. Lipari, Scuola Superiore S. Anna, Italy
H. Zeng, McGill University, Canada
L. Palopoli, University of Trento, Italy
S. Obermeier, ABB Corporate Research, Switzerland
M. Kreutz, Universidade Federal do Rio Grande do Norte, Brasil
M. Behnam, MRTC/Mälardalen University, Sweden
L. Almeida, Fac. de Eng. da Universidade do Porto, Portugal
S. Schneele, Airbus Group Innovations, Germany
M. Wahler, ABB Corporate Research, Switzerland
T. Vardanega, University of Padua, Italy
K. Gruettner, OFFIS, Germany
P. Pedreiras, University of Aveiro, Portugal
P. Eles, Linköping University, Sweden
E. Macii, Politecnico di Torino, Italy
D. Broman, University of California, USA
R. Graf, Siemens AG Industry Sector, Germany
C. Scherrer, Thales Austria GmbH, Austria
S. Tucci-Piergiovanni, CEA List, France
A. Girault, INRIA, France
A. Mifdaoui, University of Toulouse/ ISAE, France
M. Alves, CISTER Research Unit, Politécnico do Porto, Portugal
T. Facchinetti, University of Pavia, Italy
S. Baruah, University of North Carolina, USA
R. Pellizzoni, University of Waterloo, Canada
D. Atienza, Embedded Systems Laboratory, STI, EPFL, Switzerland
M. Marinoni, Scuola Superiore S. Anna, Italy
H. Li, University of Pittsburgh, USA
J. H. Ahn, Seoul National University, South Korea
M. Coppola, STMicroelectronics, France
S. Petersen, SINTEF, Norway
K. Goossens, Eindhoven University of Technology, the Netherlands
G. Lima, Federal University of Bahia, Brasil
P. Coussy, Université de Bretagne-Sud, France
W. Steiner, TTTech Computertechnik AG, Austria
M. Götz, Federal University of Rio Grande do Sul, Brasil
M. Oriol, ABB Corporate Research, Switzerland
P. Marti, Technical University of Catalonia, Spain
D. Reinhardt, BMW AG, Germany
Q. Zhu, University of California Riverside, USA

Prof. René Krenz-Baath

Hamm-Lippstadt University of Applied Sciences