Miguel Heredia Conde
Dr.-Ing. habil. Miguel Heredia Conde
Group leader
Compressive Sensing for the Photonic Mixer Device (PMD)
Room: PB-H 106
Telephone: +49 (0)2 71/7 40 - 24 65
E-Mail: heredia@zess.uni-siegen.de
Biography
Miguel Heredia Conde received the Dr. Eng. degree in the field of sensor signal processing from the University of Siegen in 2016. In 2013, he joined the Center for Sensorsystems (ZESS), at the University of Siegen. Since then he has also been a member of the DFG Research Training Group GRK 1564 "Imaging New Modalities". Since 2016 he is the leader of the research group "Compressive Sensing for the Photonic Mixer Device" and since 2020 also the general manager of the H2020-MSCA-ITN "MENELAOSNT". His current research interests include Time-of-Flight imaging systems, such as those based on the Photonic Mixer Device (PMD), Compressive Sensing, Computational Imaging, and unconventional sensing. He is responsible for two lectures with focus on Compressive Sensing at the University of Siegen. He is a member of the IEEE and VDE-ITG professional societies, and a regular reviewer of top-level conferences (ICASSP, etc.), Elsevier and IEEE Transactions, Letters, and Journals, and of the DFG (German Research Foundation). He has been a visiting researcher at CiTIUS (Area of Artificial Vision), University of Santiago de Compostela, at the Faculty of Physics (Division of Information Optics), University of Warsaw, and at the Department of Electrical and Electronic Engineering, Imperial College London. In 2020 he has been a visiting lecturer at the Department of Applied Mathematics I, University of Vigo. He has also been an invited speaker at several talks and seminars and received several awards for his research work.
Team
Demos
- Heredia Conde, M.; Singh, R. U.: “Live Demonstration: A Trimodal Time-of-Flight Camera with Enhanced Material Imaging”, 2022 IEEE SENSORS, Dallas, USA, Oct. 30 – Nov. 2, 2022.
- Ahmed, F.; Heredia Conde, M.; López Martínez, P.; Kerstein, T.; Buxbaum, B.: “Live Demonstration: VLC-Enabled Passive 3D Time-of-Flight Imaging”, 2022 IEEE SENSORS, Dallas, USA, Oct. 30 – Nov. 2, 2022.
- Heredia Conde, M.; Singh, R. U.: “Live
Demonstration of a Trimodal Time-of-Flight Camera with
Enhanced Material Imaging”, International Conference on
Computational Photography (ICCP), Pasadena, USA, August,
2022.
Poster Video - Ahmed, F.; Heredia Conde, M.; López Martínez;
P., Kerstein, T.; Buxbaum, B.: “VLC-enabled
Passive 3D Time-of-Flight Imaging”, International
Conference on Computational Photography (ICCP), Pasadena,
USA, August, 2022.
Video - Miguel Heredia Conde, Thomas Kerstein, Bernd
Buxbaum and Otmar Loffeld: “Live Demonstration: a
Trimodal Time-of-Flight Camera Featuring Material Sensing”,
19th IEEE SENSORS Conference, Rotterdam, Netherlands,
October, 2020.
Abstract Poster Video - Miguel Heredia Conde, Otmar Loffeld, Thomas
Kerstein and Bernd Buxbaum: “A Single-Wavelength
Real-Time Material-Sensing Camera Based on Time-of-Flight
Measurements”, 45th International Conference on Acoustics,
Speech, and Signal Processing (ICASSP 2020), Barcelona,
Spain, May, 2020.
Poster Video - Miguel Heredia Conde, Ayush Bhandari, Thomas
Kerstein, Bernd Buxbaum and Otmar Loffeld: “Live
Demonstration: Multiple-Path Depth Imaging with
Time-of-Flight Sensors”, 18th IEEE SENSORS Conference,
Montreal, Canada, October, 2019.
Abstract Poster Video - Miguel Heredia Conde, Ayush Bhandari, Thomas
Kerstein, Bernd Buxbaum and Otmar Loffeld: “Signal
Processing with Time-of-Flight Sensors”, 44th International
Conference on Acoustics, Speech, and Signal Processing
(ICASSP 2019), Brighton, UK, May, 2019.
Poster Teaser Images
Publications
Downloads