Regular Papers:
Submission deadline (Extended)
March 15, 2015
WiP papers:
Submission deadline (Extended)
April 19, 2015
SIES'2015: 10th IEEE International Symposium on Industrial Embedded Systems
Sponsored by: University of Siegen, and IEEE Industrial Electronics Society
Download call for papers (PDF version)
Background
Application domains have had a considerable impact on the evolution of embedded systems, in terms of requiredmethodologies and supporting tools and resulting technologies. SoCs are slowly making inroads in to the area of industrial automation to
implement complex field-area intelligent devices which integrate the intelligent sensor/actuator functionality by providing on-chip signal onversion, data processing, and communication functions. There is a growing tendency to network field-area intelligent devices around ndustrial type of communication networks. Similar trends appear in the automotive electronic systems where the Electronic Control Units ECUs), typically implemented as heterogeneous system-on-chip, are networked by means of one of safety-critical communication protocols.
Aim
The aim of the symposium is to bring together researchers and practitioners from industry and academia and provide them with a platform to report on recent developments, deployments, technology trends and research results, as well as initiatives related to embedded systems and their applications in a variety of industrial environments.
Topics include, but are not limited to:
Embedded Systems
Design and Validation of Embedded Systems; Real-Time Issues; Models of Embedded Computation; Design and Verification Languages; Operating Systems and Quasi-Static Scheduling; Timing and Performance Analysis; Power Aware Embedded Computing; Adaptive Embedded Systems; Security in Embedded Systems.
System-on-Chip and Network-on-Chip Design & Testing
Design of Application-Specific Instruction-Set Processors; Design and Programming of Embedded Multiprocessors; SoC Communication and Architectures; NoC Communication and Architectures; Design of SoC/NoC; Platform-Based Design for Embedded Systems; Reconfigurable Platforms; Multiprocessor SoC Platforms and Tools; Testing of Embedded Core-based Integrated Circuits.
Networked Embedded Systems
Design Issues for Networked Embedded; Middleware Design and Implementation for Networked Embedded Systems; Self Adaptive Networked Entity Sensor Networks: Architectures, Energy-Efficient Medium Access Control, Time Synchronization Issues, Distributed Localization Algorithms, Routing, Distributed Signal Processing, Security..
Embedded Applications
Industrial Automation and Controls; Automotive Applications; Industrial Building Automation and Control; Power (sub-) Station Automation and Control; Intelligent Sensors, etc. - design, maintenance, fault tolerance & dependability, networks, infrastructure, safety and security.
Submission of Papers
Manuscripts must be submitted electronically in PDF format, according to the instructions contained in the Conference web site. Contributions must contain original unpublished work. Papers that have been concurrently submitted to other conferences or journals (double submissions) will be automatically rejected. Papers are to be submitted electronically in PDF format.
Two types of submissions are solicited: Long Papers - from 6 to 10 double-column pages (typically 8 pages). Work-in-Progress Papers - limited to 4 double-column pages. For further details, please consult the conference web pages.
Paper Acceptance
Each accepted paper must be presented at the conference by one of the authors. The final manuscript must be accompanied by a registration form and a registration fee payment proof. All conference attendees, including authors and session chairpersons, must pay the conference registration fee, and their travel expenses.
All papers, including the WiP, are going to be published in IEEEXplore.
Author's Schedule (Extended)
Regular Papers:Submission deadline: March 15, 2015 |
WiP papers:Submission deadline: April 19, 2015 |