Dr.-Ing. Kai Hahn

 

Dr.-Ing. Kai Hahn Raum: AE-C 203 Tel.: 0271 740 2472 E-Mail: kai.hahn@uni-siegen.de

Publikationen

2023

A. Keil, N. Brombach, O. Gaus, R. Brück, K. Hahn
"Opportunities of Data Medicine: Telemonitoring of Multimodal Medical Data in Outpatient Care",
XXIII Polish Conference on Biocybernetics and Biomedical Engineering (PCBBE), September 2023 (Accepted)

A. Keil, O. Gaus, R. Brück, K. Hahn
"Concept of a new Medical Data-Driven Health Care Model based on Remote Patient Monitoring",
45th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Juli 2023 (Accepted)

2022

A. Keil, K. Hahn, N. Farhan, D. Hillerkuss, R. Brück, O. Gaus
"Self-measurement of Vital Signs to Prevent and Treat Common Disease Patterns",
IEEE International Conference on e-Health and Bioengineering (EHB), November 2022, DOI: 10.1109/EHB55594.2022.9991709

A. Keil, K. Hahn, N. Brombach, N. Farhan, R. Brück, O. Gaus
"Acquisition and Processing of Biomedical Data for Outpatient Care in Rural Areas",
56th Annual Conference of the German Society for Biomedical Engineering (BMT), September 2022, DOI: 10.1515/cdbme-2022-1022

A. Keil, K. Hahn, R. Brück, N. Brombach, N. Farhan, O. Gaus
"Cloud-Based System for Vital Data Recording at Patients‘ Home",
9th International Conference Information Technology in Biomedicine (ITIB), Juni 2022, DOI: 10.1007/978-3-031-09135-3_2

2018

D. Krönert, K. Hahn, H. Kremer, G. Monheimius.
„Entwurf und Implementierung eines Sensornetzwerks zur Baustellensicherung mittels LPWAN”, 16. GMM/ITG-Fachtagung ANALOG 2018, München, September 2018.

R. Busch, K. Hahn, M. Nüsse, M. Wahl.
„Data Concepts for Manufacturing and Cost Management of Automotive IC Technologies”, VDE Automotive meets Electronics - AmE, Dortmund 2018.

 

2017

K. Hahn, M. Wahl, R. Busch, A. Grünewald, R. Brück.
„Microtechnology Management considering Test and Cost Aspects for Stacked 3D ICs with MEMS”, Proceedings Volume 10456, SPIE Nanophotonics Australasia, Melbourne, Australia 2017.

 

2015

M. Wahl, A. Grünewald, K. Hahn, R. Brück.
„3D: Defects and Reliability”, 8. GMM/GI/ITG-Fachtagung "Zuverlässigkeit und Entwurf", Siegen 2015.

M. Wahl, A. Grünewald, K. Hahn, R. Brück.
„3D: Defects and Reliability”, 8. GMM/GI/ITG-Fachtagung „Zuverlässigkeit und Entwurf - ZuE”, Siegen 2015.

 

2014

A. Grünewald, K. Hahn, M. Wahl, R. Brück
„Technologie- und Testplanung für heterogene 3D-Systeme”, Analog 2014, Hannover 2014.

A. Heinig, M. Dietrich, A. Herkersdorf, F. Miller, T. Wild, K. Hahn, A. Grünewald, R. Brück, S. Krohnert, J. Reisinger.
„System integration - The bridge between More than Moore and More Moore”, Design, Automation and Test in Europe Conference and Exhibition (DATE), Dresden 2014.

A. Grünewald, K. Hahn, M. Wahl, R. Brück.
„Technologie- und Testplanung für heterogene 3D-Systeme”, Analog 2014, Hannover 2014.

 

2013

A. Grünewald, K. Hahn, R. Brück.
„3D-ICs: Modellierung von applikationsspezifischen Prozessfolgen”, Analog 2013, Aachen 2013.

A. Grünewald, M. G. Wahl, K. Hahn, R. Brück.
„3D-Testflow Modeling and Verification”, IEEE 3D Test Workshop, Anaheim, CA, 2013.

 

2012

A. Grünewald, K. Hahn, R. Brück.
„Design Model and Data Management for 3D Integration Technologies”, Mixed Design for Integrated Circuits and Systems (MIXDES), Warschau, Polen 2012.

K. Hylla, M. Metzdorf, A. Grünewald, K. Hahn, A. Heinig, U. Knöchel, S. Wolf, F. Miller, T. Wild, A. Quiring, M. Olbrich, S. Sattler, D. Treytnar.
„NEEDS - Nanotechnik-Entwurf für 3D-Systeme”, 6. GMM/GI/ITG-Fachtagung „Zuverlässigkeit und Entwurf - ZuE”, Bremen 2012.

A. Grünewald, K. Hahn, R. Brück.
„Software-based Development of 3D Integration Flows”, International Electronics Manufacturing Technology Conference (IEMT), Ipoh, Malaysia 2012.